Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Min Trace: 3/3MIL
PCB-dikte: 1.6mm
Blinde en begraven wegen: Beschikbaar
Dikte: 00,4-3,2 mm
Dikte: 00,4-3,2 mm
Blinde en begraven wegen: Beschikbaar
Innerlijke laag-spacing: 0.15 mm
Dikte: 00,4-3,2 mm
Kleinste Gatengrootte: 0.1 mm
Min Via: 0.1 mm
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Treatment: Immersion Gold
Minimum Hole Diameter: 0.10 Mm
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Min. paneelgrootte: 50mm x 50mm
Oppervlakte: Onderdompelingsgoud
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Base Material: Aluminum Base,CUSTOM
Withstand Voltage: >3KV
Withstand Voltage: >3KV
Base Material: Aluminum Base,CUSTOM
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